电子元件与材料2011，Vol.30Issue(8)：59-62,4.
SCSP中芯片黏结层在焊接时的可靠性
Reliability of the die attach film in stacked chip scale package during solder reflow
摘要
Abstract
A micromechanical model was proposed, in which the effects of both thermal expansion and vapor pressure on the deformation of the die attach film in stacked chip scale package (SCSP) were taken into consideration. Both the vapor pressure and porosity of the die attach film at a specified temperature can be obtained with this model when the initial condition is known, and hence the reliability of the die attach film during solder reflow can be evaluated using this model. When temperature increases from 100 °C to 250 °C, the saturated vapor pressure, equivalent elastic modulus and porosity of the die attach film change from 0.10 Mpa, 925 Mpa and 0.030 to 3.98 Mpa, 10 Mpa and 0.037, respectively. Analysis shows that reductions in both the saturated vapor pressure and elastic modulus at high temperature tend to result in die attach film material failure.关键词
叠层芯片尺寸封装(SCSP)/芯片黏结层(DAF)/可靠性Key words
stacked chip scale package (SCSP)/ die attach film (DAF)/ reliability分类
数理科学引用本文复制引用
何斌斌,国凤林..SCSP中芯片黏结层在焊接时的可靠性[J].电子元件与材料,2011,30(8):59-62,4.基金项目
上海市自然科学基金资助项目(No.2610ZR1415200) （No.2610ZR1415200）
