电子元件与材料2011，Vol.30Issue(9)：43-46,4.
电阻法测量无铅焊点蠕变的有效性实验研究
Effectiveness experimental study on resistance test method for measuring creep of lead-free solder joints
摘要
Abstract
In order to research whether resistance test method which was used to evaluate the property of lead-free solder joints could accurately reflect the creep properties, the resistance strain and the shear creep (room temperature and 25 N load)of lead-free solder joints were collected synchronously by the specially-made test system. The experiments show that their change trends are similar, for both can be divided into linear phase and index phase, but the rates of change are different broadly. The time delay of their critical inflection points is related with the size factor k of the solder joints, the time delay fluctuate slightly near the zero value (±0.075) when k is in 4.5-8.5. So resistance test method is effective to measure the creep of lead-free solder joints, reflecting the creep damage preferably.关键词
无铅焊点/电阻应变/剪切蠕变/测量Key words
lead-free solder joint/resistance strain/shear creep/test引用本文复制引用
蒋礼,张健,潘毅,伍晓霞..电阻法测量无铅焊点蠕变的有效性实验研究[J].电子元件与材料,2011,30(9):43-46,4.基金项目
中南大学研究生创新工程资助项目(No.2010ssxt131) （No.2010ssxt131）
