电子元件与材料2011，Vol.30Issue(9)：57-60,4.
焊点尺寸对微焊点拉伸断裂强度的影响
Influences of solder joint size on the tensile fracture strength of microscale solder joints
摘要
Abstract
Adopting precise tensile testing based on the dynamic mechanical analyzer (DMA) and finite element numerical simulation method based on ANSYS software, the tensile fracture behaviors of "Cu wire/ Sn-3.Oag-O.5Cu solder/Cu wire" sandwich structure solder joints (with the diameter of 200 μm and thickness of 75-225 urn) were investigated. The results show that the average tensile fracture strengths of microscale solder joints are 79.8, 82.8, 92.5 and 104.6 Mpa when the joint's diameter is constant (200 μm) and the thicknesses are 225, 175, 125 and 75 μm in sequence. Also, the fracture position changes from the mid of the solder joint to the interface of Cu wire/solder when joint's thickness decreases.关键词
电子封装/微焊点/拉伸断裂强度/尺寸效应Key words
electronic packaging/microscale solder joint/tensile fracture strength/size effects分类
矿业与冶金引用本文复制引用
尹立孟,李望云,位松,许章亮..焊点尺寸对微焊点拉伸断裂强度的影响[J].电子元件与材料,2011,30(9):57-60,4.基金项目
重庆科技学院大学生科技创新人才培养计划资助项目 （）
重庆科技学院大学生科技创新培养训练计划资助项目 （）
