电子元件与材料2011，Vol.30Issue(9)：82-85,4.
低银无铅焊料的研制动态
Development status of low-Ag lead free solders
摘要
Abstract
The advantages of low-Ag lead free solders (w(Ag) ≤ 1.0%) are analyzed from aspects of cost, amti-dropping capability, and Ag3Sn forming in the solder bulk by comparing to those of high-Ag lead free solders. Some problems of low-Ag lead free solders in application, such as high melting point, thermal fatigue property, rework defects, are summarized, and some solutions are presented. Finally, the prospects of low-Ag lead free solders are proposed.关键词
低银无铅焊料/性能/综述/研制Key words
low-Ag lead-free solder/property/review/development分类
信息技术与安全科学引用本文复制引用
刘平,顾小龙,赵新兵,刘晓刚..低银无铅焊料的研制动态[J].电子元件与材料,2011,30(9):82-85,4.基金项目
浙江省2010年自然科学基金资助项目(No.Y4100809) （No.Y4100809）
