电子元件与材料2011，Vol.30Issue(10)：72-75,4.
HDI印制板二阶微盲填孔的构建研究
Fabricating research of two-depth micro blind via with copper filled in HDI PCB
摘要
Abstract
With the development of electronic product miniaturizing, lighting and thinning, buried and blind via structures were widely used in HDI printed circuit boards (PCB). The registration between first and second depth blind via, and the copper filling process of blind via etc. Were studied. With the results above, the principles to determine the best parameters in copper filling process and high performance HDI PCB with two-depth blind via were obtained with the registration precision within 50 μm and the dimple below 10 μm. After the reliability testing of IPC-TM-650 standard, the HDI PCB with two-depth via exhibits good qualification in all indicators and reaches IPC-6016 standard.关键词
HDI/微盲孔/二阶对位/填铜Key words
HDI/ micro blind via/ two-depth registration/ copper filling分类
信息技术与安全科学引用本文复制引用
苏新虹,周国云,王守绪,何为..HDI印制板二阶微盲填孔的构建研究[J].电子元件与材料,2011,30(10):72-75,4.基金项目
国家火炬计划资助项目(No.2008GH011435) （No.2008GH011435）
