电子元件与材料2011，Vol.30Issue(10)：5-7,3.
压电陶瓷表面金属化工艺的改进
Improvements in the surface metallization technique for piezoelectric ceramics
李学明 1张轶群 1陈伟1
作者信息
- 1. 浙江嘉康电子股份有限公司, 浙江嘉兴314000
- 折叠
摘要
Abstract
The surfaces of piezoelectric ceramic substrates were metalized using the magnetron sputtering and vacuum evaporation techniques. The effects of surface metallization technique on the bonding strength of silver layer and the ability to withstand soldering heat of the surface metal electrode of piezoelectric ceramic were studied. The results show that, compared with the vacuum evaporation technique, the magnetron sputtering technique increases the bonding strength of silver layer by 103% and the time to withstand soldering heat to more than 30 s; This technique also improves the surface metallization efficiency of piezoelectric ceramic substrate, leading to reduction in the consumption of silver by 48% and hence reduction in the production cost of piezoelectric ceramic frequency device.关键词
磁控溅射/真空蒸发/表面金属化Key words
magnetron sputtering/ vacuum evaporation/ surface metallization分类
信息技术与安全科学引用本文复制引用
李学明,张轶群,陈伟..压电陶瓷表面金属化工艺的改进[J].电子元件与材料,2011,30(10):5-7,3.
