电子元件与材料2011，Vol.30Issue(10)：31-34,4.
铌酸锂晶片的键合减薄及热释电性能研究
Study on the pyroelectric properties of lithium niobate wafer prepared by wafer bonding and thinning
摘要
Abstract
Pyroelectric material lithium niobate (LN) can be used for the preparation of sensitive layer in the sensitive element of photoelectric detector. However, as the thickness of normal LN wafer, which is 0.5 mm, is much larger than the thickness of sensitive element, LN wafer need to be processed using the thinning and polishing techniques. A novel wafer bonding and thinning technique was introduced in this study, and it mainly included: wafer bonding with RZJ-304 photoresist, grinding, polishing, separating wafers with stripper and removing photoresist with acetone. LN wafer (10mm in square) with a thickness of 50 um is prepared using this technique, and the surface of prepared LN wafer is very smooth with the surface roughness being 1.63 nm. The peak value of the pyroelectric signal of the processed LN wafer is 176 mV, which is four times that of the unprocessed wafer, fulfilling the requirements of the sensitive layer of pyroelectric detector.关键词
LN晶片/键合/减薄/抛光/热释电性能Key words
LN wafer/ bonding/ thinning/ polishing/ pyroelectric properties分类
信息技术与安全科学引用本文复制引用
杨绪军,陈箫,刘岗,牛坤旺,张文栋..铌酸锂晶片的键合减薄及热释电性能研究[J].电子元件与材料,2011,30(10):31-34,4.基金项目
国家“863”计划重大资助项目(No.2006AA040101) （No.2006AA040101）
