电子元件与材料2011，Vol.30Issue(12)：54-57,60,5.
基于裂纹扩展的无铅焊点阻抗等效模型
An equivalent impedance model for lead-free solder joints based on crack propagation
摘要
Abstract
After a case study on single solder joint, an equivalent impedance model was established for lead-free solder joints based on the crack propagation and skin effect of the joint, and the way to calculate the parameters included in the model was introduced. Simulation was then performed using the Matlab software. The results show that with the crack propagation, the impedance of solder joints changes slowly first and then abruptly. And, the higher the signal frequency is, the earlier the abrupt change takes place. At a frequency of 500 MHz, the abrupt change of impedance occurs when the area of crack is about 75% of the cross section of solder joint; while the DC resistance only changes sharply right before the failure of solder joint.关键词
无铅焊点/阻抗/等效模型/仿真Key words
lead-free solder joints/ impedance/ equivalent model/ simulation分类
通用工业技术引用本文复制引用
蒋礼,伍晓霞,潘毅,张健..基于裂纹扩展的无铅焊点阻抗等效模型[J].电子元件与材料,2011,30(12):54-57,60,5.
