电子与封装2011，Vol.11Issue(10)：7-9,3.
框架有效成本与内引线长度技术能力的关系
Introduction on the Relationship between the Efficient Lead Frame Cost and Lead Post Length Technologies
石海忠1
作者信息
- 1. 南通富士通微电子股份有限公司,江苏南通226006
- 折叠
摘要
Abstract
IC packages consist of two basic structure types, lead frame packages and substrate packages. Lead frame packages still hold dominant position in the present semiconductor industry, but the cost of the lead frame packages is facing great challenges due to a sky rocketing price of the nonferrous metal in recent years. An efficient cost reduction through technical means is the most safe and feasible direction. In this thesis, under the circumstances of the rise in gold wire price, with comparison of the differences between lead post length technologies, which we discover that has an obvious effect on the efficient cost of the lead frame. That is to say, not only should we compare the prices but also should pay more attention to the lead post length technologies on the new multi-lead frames selections to achieve the lowest efficient lead frame cost.关键词
集成电路封装/引线框架/有效成本Key words
IC packaging/lead frame/effective cost分类
信息技术与安全科学引用本文复制引用
石海忠..框架有效成本与内引线长度技术能力的关系[J].电子与封装,2011,11(10):7-9,3.
