电子与封装2012，Vol.12Issue(1)：1-6,6.
绿色环保无卤阻燃环氧塑封料的研究与发展
Research and Development of Halogen Free Flame Retardant Epoxy Molding Compounds
摘要
Abstract
With the rapid development of advanced microelectronic packaging and the ever-rising demands of global environmental protection, halogen-free flame retardant epoxy molding compounds （EMCs） have been paid much attention in recent years. Recent research and development of halogen free flame retardant EMCs have been reviewed in the present work. The homo-polymerized, copolymerized and fluorinated phenol-aralkyl phenolic resin hardener, epoxy, and EMC were separately summarized. The present status of green EMCs studies in 1CCAS was also introduced. Finally, the future developing trends of green EMC industry in China are prospected.关键词
环氧塑封料/酚醛树脂/苯酚-芳烷基/无卤阻燃Key words
epoxy molding compound/phenolic resin/phenol-aralkyl/halogen-flee retardant分类
信息技术与安全科学引用本文复制引用
宋涛,李志生,封其立,王超,刘金刚,杨士勇..绿色环保无卤阻燃环氧塑封料的研究与发展[J].电子与封装,2012,12(1):1-6,6.基金项目
科技部02专项资助课题 （）
