摘要
Abstract
The current IC wafer ling width characteristics is micronanoelectronic scale. The microminiaturization process of electronic products and electronic systems will depend on the advanced packaging technology .It has increasingly become a focus of the semiconductor industry. Novel packaging technology with larger market value around home and abroad in recent years are introduced. Basic structures and fabrication processes of some typical packaging are bescribed in detail. Furthermore, it is pointed out current status and development trend of packaging technology.In the recent years, endless varieties of packagings are proposed. It implements a new and higher level of packaging integration with higher assemble density, more strong features, better performance, smalles size, lower power consumption, faster speed, smaller delay, cost reduction,etc. Researches and process of packaging cannot be ignored. It has a great market potential and development in the days to come. Advanced packaging technology are forcing semiconductor industry access the More-than-Moore era .关键词
高密度封装/3D封装/封装技术/封装结构/发展趋势Key words
high density packaging/3D packaging/packaging technology/packaging structure/development trend分类
信息技术与安全科学
