电子元件与材料2012，Vol.31Issue(1)：55-58,4.
低银SnAgCu系无铅焊膏的板级工艺适应性研究
Investigation on board-level process adaptability of low-Ag lead-free solder paste
摘要
Abstract
Low Ag lead-free solder pastes of G-SAC105 and G-SAC0307 were developed recently. The research of the board-level packaging process adaptability of solder pastes was carried out. Result shows that both of solder pastes have good property of anti-slump, the slumps of the pastes were 0.15 mm at (25±5) ℃ or 120 ℃, and 0.20 mm at 150 ℃. Lower Ag contents in solder pastes do not affect the slump. Without any holes or splashing phenomenon, both the solder pastes show a high quality of printing with bright plump solder joints. G-SAC105 and G-SAC0307 have similar thickness of the intermetallic compound that are lower than that of SAC305.关键词
低银无铅焊膏/工艺适应性/印刷性Key words
low-Ag lead-free solder paste/ process adaptability/ printability分类
信息技术与安全科学引用本文复制引用
张寒,雷永平,林健,杨金丽..低银SnAgCu系无铅焊膏的板级工艺适应性研究[J].电子元件与材料,2012,31(1):55-58,4.基金项目
现代焊接生产技术国家重点实验室开放课题研究基金资助项目(No.09010) （No.09010）
北京市自然科学基金和重点项目基金资助项目(No.3102002) （No.3102002）
