电子元件与材料2012，Vol.31Issue(3)：53-56,4.
水基无卤素无松香抗菌型免清洗助焊剂
A kind of water-based halogen-free rosin-free antibacterial no-clean flux
赵晓青 1肖文君 1杨欢 1王丽荣 1黄德欢1
作者信息
- 1. 南昌大学纳米技术工程研究中心,江西南昌330031
- 折叠
摘要
Abstract
A kind of no-clean flux for lead-free solder was prepared. For the preparation of the flux, a kind of composite surfactant was used, while the deionized water, organic alcohol/ether with high boiling point and organic acids were employed as the solvent, auxiliary solvent and active agent, respectively. A kind of natural antibacterial agent E was also added to extend the shelf life of the flux. The components were selected, the composition was optimized, and the properties was studied for the flux. The results show that the flux is transparent, homogeneous, pungent-smell and halogen free and non-corrosive, and shows a surface insulation resistance above 108 Ω. When the flux is used for lead-free SnAgCu solder, an excellent soldering performance and an average expansion rate of 76.6% are reached.关键词
助焊剂/免清洗/焊接性能/抗菌剂Key words
flux/ no-clean/ soldering performance/ antibacterial agent分类
信息技术与安全科学引用本文复制引用
赵晓青,肖文君,杨欢,王丽荣,黄德欢..水基无卤素无松香抗菌型免清洗助焊剂[J].电子元件与材料,2012,31(3):53-56,4.
