电子与封装2012，Vol.12Issue(2)：6-8,3.
一种低成本专用混合微电路封装技术
A Cheap Specific Hybrid Microcircuit Packaging Technology
王万一1
作者信息
- 1. 华东光电集成器件研究所,江苏苏州215163
- 折叠
摘要
Abstract
With the development of semiconductor technology, whether it is the product of technical indicators, or the cost of long-term reliability, choose the appropriate packaging technology seems extremely important. This pape describes a hybrid mircrocircuit silica gel instill package process,it boasts of characteristics as nice outlook, lost cost. rework capability, while suitable for vibration, temperature and other harsh environment, but also to meet the cooling demand for medium-power circuits.关键词
封装/滴注Key words
packaging/instill分类
信息技术与安全科学引用本文复制引用
王万一..一种低成本专用混合微电路封装技术[J].电子与封装,2012,12(2):6-8,3.
