电子与封装2012，Vol.12Issue(2)：33-36,43,5.
一种混合厚膜电路引线绕焊技术
A Hybrid IC Lead Circumcolumnar Welding Technology
周峻霖 1夏俊生 1侯育增 1肖勇兵1
作者信息
- 1. 华东光电集成器件研究所,安徽蚌埠233042
- 折叠
摘要
Abstract
Microelectronic lead welding is both key processing technology and the weakest point of Hybrid IC research. Hybrid Power circuits maintains high working temperature, the module assembly temperature could reach 300~C; while applied with common solder paste in Lead welding, the high temperature raised during device assembly would cause the internal solder paste to melt, then the leads would move off from their original locations, leading to circuits failure ＆ lowering-down of comprehensive welding reliability. This paper introduced an Lead Circumcolumnar Welding technology, and also described the research course and experiments. Moreover, through many examples and test data, it verified a practical processing method and criterion of Lead Circumcolumnar Welding using varied solder pastes, obtained the welding Specification. Through research, the silver-plated copper wire welding strength has been assured, and the oower ＆ soace aoolication circuits lead weldin~ reliability bein~ ~reatlv imoroved.关键词
混合厚膜电路/外引线焊接/绕焊/可靠性Key words
hybrid IC/lead welding/circumcolumnar welding/reliability分类
信息技术与安全科学引用本文复制引用
周峻霖,夏俊生,侯育增,肖勇兵..一种混合厚膜电路引线绕焊技术[J].电子与封装,2012,12(2):33-36,43,5.
