电子与封装2012，Vol.12Issue(3)：6-9,18,5.
COB封装对LED光学性能影响的研究
Research of the Effect on the LED Optical Performance from COB Packaging
祁姝琪 1丁申冬 2郑鹏 1秦会斌1
作者信息
- 1. 杭州电子科技大学新型电子器件与应用研究所,杭州310018
- 2. 浙江古越龙山电子科技发展有限公司,浙江绍兴312000
- 折叠
摘要
Abstract
In this paper,the COB（Chip On Board） packaging technology is adopted in LED products to meet the requirements of high efficiency and low power dissipation.The optical features of LEDs are analyzed first.Subsequently,different packaging technology and materials are introduced to make a comparison between each other＇s effects on the flux,luminous efficiency and color temperature.Finally,the COB packaging technology is presented.After the introduction of its structure,advantages and practical utility,experiments are conducted.The experimental results show that the COB packaging not only has the capability of protecting the LED chips,but improves the efficiency and achieves specific optical distribution.Consequently,the proposed packaging technique achieves an increase on the luminous efficiency and adjusting of color temperature.关键词
COB/光学性能/LEDKey words
COB/optical performance/LED分类
信息技术与安全科学引用本文复制引用
祁姝琪,丁申冬,郑鹏,秦会斌..COB封装对LED光学性能影响的研究[J].电子与封装,2012,12(3):6-9,18,5.
