电子元件与材料2012，Vol.31Issue(6)：79-83,5.
Sn基无铅钎料与Cu基板间化合物Cu6Sn5的研究进展
Research development of compound Cu6Sn5 between Sn-based lead-free solders and Cu substrate
摘要
Abstract
The relation of reliability of soldering joints and the intermetallic compound (IMC) Cu6Sn5 resulted from the interfacial reaction between Sn-based lead-free solders and Cu substrates is introduced. The research developments about Cu6Sn5 in this years are reviewed, whose contents include the growth morphology, crystal orientation, growth kinetics and the effect of nano-particles on the size and morphology of Cu6Sn5 phase formed between Sn-based solders and Cu substrates.关键词
Sn基无铅钎料/Cu6Sn5/综述/生长形态Key words
Sn-based lead-free solder/ Cu6Sn5/ review/ growth morphology分类
矿业与冶金引用本文复制引用
胡小武,艾凡荣,闫洪..Sn基无铅钎料与Cu基板间化合物Cu6Sn5的研究进展[J].电子元件与材料,2012,31(6):79-83,5.基金项目
中国博士后科学基金资助项目(No.20110491492) （No.20110491492）
江西省青年科学基金资助项目(No.20114BAB216017) （No.20114BAB216017）
江西省教育厅科技资助项目(No.GJJ12035) （No.GJJ12035）
