摘要
Abstract
Wire bonding is an important process in the SMD package. The 6400 bonder from F＆K corporation is an ultrasonic wedge bonder for thin aluminium wire. In wire bonding process, depending on the production requirements, different pad metallizations are used and different metallurgical system can be formed, which may cause a problem in reliability of the bonds because of interface corrosion or Kirkendall voids; bonding parameters, such as ultrosonic power, bonding time, bonding force and bonding mode, control the bonding yield and reliability directly. Based on mass production, analysis of the bonding material and process parameters for F＆K 6400 bonder used in the production, and lists the common problems and possible causes for the machine.关键词
F＆K/6400/冶金系统/超声功率/键合时间/键合压力/键合方式/常见故障Key words
F&K 6400/metallurgical system/ultrosonic power/bonding time/bonging force/bonding mode/common problem分类
信息技术与安全科学
