电子与封装2012，Vol.12Issue(7)：11-14,20,5.
环氧模塑料中应力改质剂的使用讨论
The Analysis of Stress Modifier in Epoxy Molding Compound
王殿年 1李进 1郭本东1
作者信息
- 1. 长兴电子材料有限公司,江苏昆山215301
- 折叠
摘要
Abstract
In the process of semiconductor packaging, There are many reasons can cause delamination in package body, such as temperature, thermal expansion and stress. This study adds liquid stress modifier of epoxy molding compound to reduce thermal stress, and improve the delamination. The stress modifier include liquid and solid, in our study will focus on liquid modifier, and test more data of solid and liquid stress modifier in the use of the advantages and disadvantages.关键词
应力改质剂/内应力/环氧模塑料Key words
stress modifier/thermal stresses/epoxy molding compound分类
信息技术与安全科学引用本文复制引用
王殿年,李进,郭本东..环氧模塑料中应力改质剂的使用讨论[J].电子与封装,2012,12(7):11-14,20,5.
