电子与封装Issue(8)：1-4,4.
覆Ag层对用于LD封装的In焊料性能的影响
The Effection of Ag Covered Layer on the Performance of Indium Solder for LD Package
王永平 1程东明 1伏桂月 1张勇 1卢小可 1张微微1
作者信息
摘要
Abstract
Indium solder is wildly used in welding laser diode(LD) due to its excellent plasticity, good electrical conductivity and thermal conductivity properties. Indium solder is oxidized easily in air. Especially in the process of welding, the oxidation phenomenon is more obvious. It’s usually used as the day as it’s prepared[1].In order to provent indium solder from oxidation, a layer of Ag or Au is usually plated on the top of indium solder as a protection layer[2~3].Consider the cost factor, Ag is the first choice of protection layer. Though the research about the performance of In-Ag alloy has been reported a lot[4~9],they concern about surface morphology of In-Ag alloy and the effection of the thickness of Ag layer on internal indium solder little. In this paper, we analyzed surfaces and compositions of different samples through scan electron microscope and X-Ray Diffraction method, get the effection of Ag layer on internal solder and surface morphologies under different cooling rate.关键词
In焊料/Ag层/氧化/In-Ag合金Key words
Indium solder/Ag layer/oxidation/In-Ag alloy分类
信息技术与安全科学引用本文复制引用
王永平,程东明,伏桂月,张勇,卢小可,张微微..覆Ag层对用于LD封装的In焊料性能的影响[J].电子与封装,2012,(8):1-4,4.
