电子与封装Issue(10)：1-2,13,3.
真空炉金锡封焊
AuSn Solder Packaging in Vacuum Oven
刘艳 1徐骁 1陈洁民 1陈凯1
作者信息
- 1. 中国电子科技集团公司第55研究所,南京 210016
- 折叠
摘要
Abstract
In this paper,with the introduction of semiconductor packaging technology of AuSn solder, emphasis on the deep research of technology problems of AuSn solder and temperature curve settings. Based on many vacuum AuSn solder packaging experiments and theoretical analysis,research the technologies of module gas-tight packaging. Discusses the effects of packaging fixture,lid plating layer,alloy state,interface,pressing block,solder thickness and heating process to the solder packaging. The gas-tight performance can be fairly meet after environment mechanism test. The feasibility of alloy used and packaging technique can be proved according to the application background.关键词
金锡焊料/真空/炉温曲线Key words
AuSn solder/vacuum/temperature curve分类
信息技术与安全科学引用本文复制引用
刘艳,徐骁,陈洁民,陈凯..真空炉金锡封焊[J].电子与封装,2012,(10):1-2,13,3.
