摘要
Abstract
When the environmental temperature, humidity change, plastic packaging integrated circuit internal different material interface will produce the delamination, delam cause circuit loop open or intermittent bad contact, greatly affect the function of the IC and service life.Packaging BOM (such as:chip/frame/epoxy/resin ) is to determine IC MSL level and delam level of basic, assembly process design, process control method, product to prevent external force damage and thermal stress protection are influencing factors of delamination, BOM combination need to consider the strength between reinforcing material and close to the modulus of thermal expansion, design the chip PO layer reduce the circuit surface concave-conve, frame groove and convex platform design, manufacturing process pollution prevention/anti-oxidation control, etc., are all improve IC products internal delamination effective ideas. DOE is helpful to the complex manufacturing process found the root causes of delamination.关键词
封装/BOM/SAM/框架/装片胶/分层/研磨Key words
assembly/BOM/SAM/lead-frame/epoxy/delamination/cross section分类
信息技术与安全科学
