电子与封装Issue(10)：14-18,5.
利用DSC测定LED封装环氧树脂玻璃化转变温度
The Tg of the LED Package Epoxy Resin Measured by DSC
林达儒 1谭艳娥 1龚丹雷 1刘强辉1
作者信息
- 1. 佛山市国星光电股份有限公司,广东佛山528000
- 折叠
摘要
Abstract
As an important heat analysising method, DSC is generally used in all kinds of solidfied systems. In this paper, the basic knowledge of DSC is introduced. And the use of DSC to determine the LED package epoxy glass transition temperature of the test conditions was studied, the comparison and evaluation of the different test conditions, and the test. Practice shows that, under the premise of the nitrogen, in order to obtain obvious DSC curve, the sample particle size should be as small as possible, preferably a powder and compacted;the sample volume of 10mg to 15mg or so is appropriate;the instrument heating rate of 10K/min~15K/min is appropriate;the sample packed in the aluminum crucible to be tested to be compaction with a tool. The test conditions of the actual test is very instructive.关键词
DSC/环氧树脂/玻璃化转变温度/铝坩埚Key words
DSC/epoxy resin/Tg/aluminum crucible分类
信息技术与安全科学引用本文复制引用
林达儒,谭艳娥,龚丹雷,刘强辉..利用DSC测定LED封装环氧树脂玻璃化转变温度[J].电子与封装,2012,(10):14-18,5.
