电子与封装Issue(9)：1-5,5.
高密度陶瓷封装电设计中噪声控制研究
Analysis of Noise in Electrical Design of High-density Ceramic Package
杨轶博 1丁荣峥 1高娜燕 1李欣燕1
作者信息
- 1. 中国电子科技集团公司第58研究所，江苏无锡214035
- 折叠
摘要
Abstract
With the increasing of the density, frequency and transmission speed of ICs, the problems of electric signal noise are becoming more and more remarkable in the term of package interconnections. The substance of signal noise is the problem such as the decay of signal quality and the instability of reference voltage, which are induced by parasitic RCL of transmission line. Relfection, cross-talk and SSN are very common electrical noise problems in high-density ceramic package designing. This paper introduces causes, harm and solutions of the three SI/PI problems in ceramic package designing. Based on SI/PI theories, the designing of one ceramic substrate with high density and frequency is introduced.关键词
信号噪声/反射/串扰/同步开关噪声/信号完整性/电源完整性Key words
signal noise/relfection/cross-talk/SSN/SI/PI分类
信息技术与安全科学引用本文复制引用
杨轶博,丁荣峥,高娜燕,李欣燕..高密度陶瓷封装电设计中噪声控制研究[J].电子与封装,2013,(9):1-5,5.
