电子与封装Issue(10)：5-9,5.
基于封装工艺识别翻新塑封集成电路
Detect the Remark Plastic ICs on the Basis of Packaging Technology
杨城 1张吉 1马清桃 1潘凌宇1
作者信息
- 1. 湖北航天计量测试技术研究所，湖北孝感432100
- 折叠
摘要
Abstract
Plastic packaging ICs have been used more widely in the high reliability application, and there are a number of plastic packaging ICs are applied to national defense fields. But the stock channel is not so fluency, and most of the chief plastic packaging ICs are imported from abroad, so there exist a mass of remark ICs. Based on packaging technology, the author will introduce how to detect the remark ICs.关键词
高可靠性/翻新/塑封集成电路Key words
high-reliability/remark/plastic packaging ICs分类
信息技术与安全科学引用本文复制引用
杨城,张吉,马清桃,潘凌宇..基于封装工艺识别翻新塑封集成电路[J].电子与封装,2013,(10):5-9,5.
