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TO-220FS封装工艺改进研究

方逸裕 管贝林

电子与封装Issue(11):5-7,3.
电子与封装Issue(11):5-7,3.

TO-220FS封装工艺改进研究

Study of Assembly Technology for TO-220FS

方逸裕 1管贝林1

作者信息

  • 1. 汕头华汕电子器件有限公司,广东汕头515041
  • 折叠

摘要

Abstract

This paper shows the dififculties of production, process the various technical by analyzing and contrasting the difference of the internal structure between the TO-220FS package and general product. And then by analyzing the causes of technical difficulties and taking the corresponding solutions, the technical difficulties are overcome smoothly. The process including process conditions, technology, equipment modiifcation, solve the problem of solder thickness control, eliminate stress in wire process, plastic pinhole, drunker, tendon pull in trimming process, isolation testing etc, the mass production successfully achieved.

关键词

单厚度/锡层控制/应力作用/针孔/拉筋/绝缘测试

Key words

single gage/solder thickness/stressed/pinhole/tendon pull/ISO test

分类

信息技术与安全科学

引用本文复制引用

方逸裕,管贝林..TO-220FS封装工艺改进研究[J].电子与封装,2013,(11):5-7,3.

电子与封装

1681-1070

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