摘要
Abstract
With the development of semiconductor power devices, chip’s cooling of the device was one of the factors which has been restricting the power devices’ development. The device’s cooling was mainly through the internal heat conduction out of the back of the chip. The chip welding heat from the device directly affect one of the key factors is good or bad, the obvious advantages of alloy solder’s thermal conductivity is good, therefore widely used in high power devices(such as Au80Sn20, Au99.4Sb0.6, etc), but as a result of alloy solder caused large residual stress after sintering, sintering process is less application on the chip size greater than 8 mm×8 mm. In the paper, 11.5 mm×11.5 mm large chip sintering experiment was carried out uses Au-Sn alloy, through the analysis of the causes of stress, from material, packaging process, etc, to take steps to reduce stress, and veriifed the reliability assessment of packaging products. The experimental results show that there is no chip failure.关键词
超大面积芯片烧结/金锡共晶/去应力/可靠性试验Key words
large chip sintering/Au-Sn eutectic/stress removal/reliability test分类
信息技术与安全科学
