电子与封装Issue(2)：9-12,15,5.
金刚石/铜复合散热材料的制备和检测
Preparation and Measure of Diamond/Cu Heat Dissipation Materials
牛通 1韩宗杰 1张梁娟 1王从香 1严伟1
作者信息
摘要
Abstract
As a new generation of electronic packaging material, Diamond/Cu composites have excellent performances such as high thermal conductivity and adjustable CTE.The bottle-neck factors in the application were studied in this paper. In order to improve the solder ability, Ti-Cu-Ni-Au compound-plating on Diamond/Cu was produced by PVD and ECD, the compound-plating has good adhesion strength and solder ability. Furthermore, compound-plating has good wettability with Au80Sn20. The result show that, Diamond/Cu has more excellent effectiveness of heat-emission on the same condition, which the temperature fall reach 20℃compare to MoCu.关键词
金刚石/铜/电子封装材料/膜层/可焊性/散热效果Key words
diamond/Cu/electronic packaging material/plating/wettability/effectiveness of heat-emission分类
信息技术与安全科学引用本文复制引用
牛通,韩宗杰,张梁娟,王从香,严伟..金刚石/铜复合散热材料的制备和检测[J].电子与封装,2014,(2):9-12,15,5.
