电子与封装Issue(3)：1-4,4.
ACF键合中导电粒子捕捉及变形的影响机理与实验
Study on Mechanism and Experiment of the Capture and Deformation of Conductive Particles During ACF Bonding Process
摘要
Abstract
It needs deeply understand the mechanism of the capture and deformation of conductive particles to enhance the conductive properties during ACF bonding process. The paper presents the law of the capture and deformation of conductive particles under different process parameters through experiments and carries out the theoretical analysis. Experimental results show that with the bonding pressure increasing the number of conductive particles capture showing a decreasing trend, the deformation of the conductive particles showing an increasing trend, meanwhile, with the bonding temperature increasing the deformation of conductive particles showing a ifrst increasing and then decreasing trend, when the bonding temperature reached 230℃, the number of conductive particles capture rose rapidly.关键词
ACF/键合工艺/粒子捕捉与变形/导电性能Key words
ACF/bonding process/conductive particles capture and deformation/conductive properties分类
信息技术与安全科学引用本文复制引用
朱钦淼,陶波,徐仁骁,黄扬,吴光华..ACF键合中导电粒子捕捉及变形的影响机理与实验[J].电子与封装,2014,(3):1-4,4.基金项目
国家自然科学基金项目（50805060）；国家重大专项课题 （）
