电子与封装Issue(3)：37-40,4.
集成电路制造中制程能力的提升
Process Ability Improve in Integrated Circuit Manufacturing
向璐1
作者信息
- 1. 中国电子科技集团公司第58研究所，江苏无锡214035
- 折叠
摘要
Abstract
Integrated circuit manufacturing need go through hundreds of steps. If there is something wrong in one step, it will lead wafer scrap. So to detect and solve the problems timely is very important for manufacturing. Using SPC method in integrated circuit manufacturing need set up efifciency control limit and available monitoring frequency. Then can detect the problems timely, and push engineers to solve it. Thus the process ability can be improved, and process in a controlled state.关键词
集成电路制造/制程能力/SPC/CPKKey words
integrated circuit manufacturing/process ability/SPC/CPK分类
信息技术与安全科学引用本文复制引用
向璐..集成电路制造中制程能力的提升[J].电子与封装,2014,(3):37-40,4.
