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铝线键合的等离子清洗工艺研究

钟小刚

电子与封装Issue(4):31-33,41,4.
电子与封装Issue(4):31-33,41,4.

铝线键合的等离子清洗工艺研究

Study on Plasma Cleaning Process of Aluminium Wire Bonding

钟小刚1

作者信息

  • 1. 广东风华芯电科技股份有限公司,广州510663
  • 折叠

摘要

Abstract

DOE is used to optimize the parameter combination as power, timing and velocity in plasma cleaning, by comparing the pull strength value, STD and PpK. And analyzed the influence of leadframe position in the magzine with plasma cleaning effect, the leadframe where exposed in high density of plasma atmosphere is superior to others in cleaning effect, such as higher bonding pull strength, lower STD and excellent process control ability.

关键词

等离子清洗/铝线/DOE

Key words

plasma cleaning/aluminium wire/DOE

分类

信息技术与安全科学

引用本文复制引用

钟小刚..铝线键合的等离子清洗工艺研究[J].电子与封装,2014,(4):31-33,41,4.

电子与封装

1681-1070

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