电子与封装Issue(5)：14-17,22,5.
高可靠性塑封器件质量控制措施
Quality Assurance of PEM for High-reliability Applications
蒋颖丹 1梁琦1
作者信息
- 1. 中国电子科技集团公司第58研究所，江苏无锡214035
- 折叠
摘要
Abstract
With the applications of plastic encapsulated microcircuit(PEM)in high-reliability field increasingly widespread, the demand for development and production of PEM also rises. Possible presence of thermal mechanical defects, corrosion, popcorn effect, as well as the production process which may introduce package, chip bonding problem, passivation defects and so on are analyzed, with control measures from design and process point of view. Both domestic and foreign selection, screening and qualiifcation of high-reliability PEM products are introduced, in order to eliminate the goods with potential pitfalls, and ensure high reliability.关键词
塑封器件/可靠性/质量控制Key words
PEM/reliability/quality assurance分类
信息技术与安全科学引用本文复制引用
蒋颖丹,梁琦..高可靠性塑封器件质量控制措施[J].电子与封装,2014,(5):14-17,22,5.
