电子与封装Issue(5)：37-41,5.
高温贮存寿命评估试验
Assessment of IC Reliability in Long Storage Life Test
管光宝 1凌勇 1俞浩新1
作者信息
- 1. 中国电子科技集团公司第58研究所，江苏无锡214035
- 折叠
摘要
Abstract
Steady temperature storage to devices was conducted in normal and high temperature, in which procedure, collect device’s electrical parameters after enduring steps, simulate the changing figure in comparison with factor of storage time, analyze the failure modes. accelerating factor can be gotten in the experimental indeed. Temperature’s accelerating effects and effectiveness will be used to evaluate long storage device’s life, and ifnally aimed to qualiifed device’s real storage life in accelerating modes.关键词
长期贮存寿命/失效模式/高温Key words
long storage life/failure mode/high temperature分类
信息技术与安全科学引用本文复制引用
管光宝,凌勇,俞浩新..高温贮存寿命评估试验[J].电子与封装,2014,(5):37-41,5.
