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基于Minitab DOE的铝丝楔焊键合工艺参数优化

廖小平 李宗亚 杨兵

电子与封装Issue(6):7-11,5.
电子与封装Issue(6):7-11,5.

基于Minitab DOE的铝丝楔焊键合工艺参数优化

Optimization of Aluminum Wedge Bonding Process Parameters Based on Minitab DOE

廖小平 1李宗亚 1杨兵1

作者信息

  • 1. 无锡中微高科电子有限公司,江苏无锡 214035
  • 折叠

摘要

Abstract

Design of experiments have been done by using Minitab statistical software to improve the reliability and product quality of domestic ceramics packages, which are used for aluminum wedge bonding process. And intuitive analysis and variance analysis of the design of experiments results of CQFP84 domestic ceramic package, which are used for aluminum wedge bonding process have been done. Ultrasonic power, ultrasonic time, bonding force and ultrasonic power ramp time on the effect of the bonding pull and its significant level have been discussed. The study shows that the second parameter of bonding pressure and ultrasonic power, and the first parameter of ultrasonic power ramp time have significant influences on bonding pull. Better bonding process parameters are obtained as bonding pull for a reference index. Bonding pull is obviously enhanced through validation experiment, and its dispersion has been improved significantly.

关键词

Minitab/试验设计/国产陶瓷外壳/铝丝楔焊/键合拉力

Key words

Minitab/design of experiments/domestic ceramics packages/aluminum wedge bonding/bonding pull

分类

信息技术与安全科学

引用本文复制引用

廖小平,李宗亚,杨兵..基于Minitab DOE的铝丝楔焊键合工艺参数优化[J].电子与封装,2014,(6):7-11,5.

电子与封装

1681-1070

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