电子与封装Issue(8)：15-17,48,4.
硅基密封气密性及结构强度研究
Study of the Silicon Hermetic Package Tightness and Structural Strength
吉勇 1高娜燕 1燕英强 1明雪飞 1陈波 1丁荣峥1
作者信息
- 1. 中国电子科技集团公司第58研究所，江苏无锡214035
- 折叠
摘要
Abstract
To research the feasibility of one novel silicon hermetic package, welding the cover with nickel and gold surface, silicon substrate surface metalized and Au80Sn20 solder pieces. Need to research the effect of cavity area changes that influence the silicon package’s structure strength and the pressure that package could support, for silicon is a brittleness material. The results showed, when the section acreage of cavity less than 11 mm×27 mm, 350μm thickness silicon substrate can weld with kovar cover directly, and the package can support at least 0.1 MPa pressure while the silicon substrate with no crack.关键词
硅基封装/气密性/结构强度Key words
silicon package/hermetic/structural strength分类
信息技术与安全科学引用本文复制引用
吉勇,高娜燕,燕英强,明雪飞,陈波,丁荣峥..硅基密封气密性及结构强度研究[J].电子与封装,2014,(8):15-17,48,4.
