摘要
Abstract
With the development of the manufacturing process for the high-frequency and high-speed integrated circuit, the electronic package technology also have boarded a new height. As one of the microelectronic device manufacturing process, the interconnect structures in the package, such as vias, transmission lines and bonding wires, may have impacts on the performance of the circuit. So it is important to analyze the signal integrity in the advanced IC package design. A bonding wire interconnection transmission structure is presented in the paper, which is simulated by the full-wave analysis software. The impact of the key parameters, such as the material of bonding wire, the span of the bonding wire, the high arch of the bonding wire and the length of the microstrip, the width of the microstrip, were analyzed and summarized on the signal integrity of the package system. The simulation results provide a practical guide for the package design.关键词
键合线传输结构/IC封装/信号完整性Key words
bonding wire transmission structure/IC package/signal integrity分类
信息技术与安全科学
