电子与封装Issue(10)：1-3,10,4.
镀金盖板上的绿激光标识技术
Green Laser Marking Technology on Gold-plated Lid
郭伟1
作者信息
- 1. 中国电子科技集团公司第58研究所，江苏无锡 214035
- 折叠
摘要
Abstract
Gold Plated lid can be widely used for Hermetic package of integrated circuits.The marks on lid surface are usually made by offset printing with ink. But the ink mark, in the authentication process, exist partially exfoliated risk (Cause authentication through difficult). The green laser marking technology on gold-plated lid, has solved the problem well which marking falls off on gold-plated lid. At the same time also solves the process problem which printing serial number on gold-plated lid of the high reliability integrated circuits. The samples after laser marking,successfully passed the test of temperature cycle,heat concussion and the salt-fog test required by GJB548B standard. Laser marking area of gold-plated lid were analyzed by SEM and dissection. The results showed that the composition and thickness of the laser marking gold layer were unchanged.关键词
气密性封装/镀金盖板/绿激光标识/盐雾试验Key words
hermetic package/gold-plated lid/green laser marking/salt-fog test分类
信息技术与安全科学引用本文复制引用
郭伟..镀金盖板上的绿激光标识技术[J].电子与封装,2014,(10):1-3,10,4.
