电子与封装Issue(11)：5-8,4.
CQFP器件板级温循可靠性的设计与仿真
Design and Simulation of Board Level Reliability for CQFP Device in Thermal Cycling
李宗亚 1仝良玉 1李耀 1蒋长顺1
作者信息
- 1. 无锡中微高科电子有限公司，江苏无锡 214035
- 折叠
摘要
Abstract
Thermal cycling is an important test for board level reliability analysis of IC packages. Ceramic Quad Flat Package(CQFP)is mostly used for surface mounting applications. Due to the thermal expansion coefifcient difference, periodic strain and stress occurs on the solder joints which may cause the solder joint fatigue failure when the package area is large. Lead forming could be realized from the upper side or the underside of the ceramic. Solder joint cracking was observed for a CQFP product with lead forming from the downside in thermal cycling, and Finite Element Method(FEM)is used to predict the fatigue life of the solder joint. Lead shape is optimized with the secondary forming method to alleviate the thermal stress. Both the simulation and test results show that the secondary method is effective in improving the board level reliability of CQFP device. When the lead forming starts from the upper side of the ceramic, there is a signiifcant improvement in solder joint fatigue life.关键词
CQFP/热循环/板级可靠性/有限元方法/疲劳寿命Key words
CQFP/thermal cycling/board level reliability/ifnite element method/fatigue life分类
信息技术与安全科学引用本文复制引用
李宗亚,仝良玉,李耀,蒋长顺..CQFP器件板级温循可靠性的设计与仿真[J].电子与封装,2014,(11):5-8,4.
