电子与封装Issue(11)：41-44,4.
超声扫描显微镜检查在倒装器件检测中的应用
The Application of Scanning Acoustic Microscope Inspect in Flip-chip Device Test
潘凌宇 1张吉 2杨城 1马清桃 2王伯淳1
作者信息
- 1. 湖北航天计量测试技术研究所，湖北孝感 432000
- 2. 中国航天科工集团元器件可靠性中心四院分中心，湖北孝感 432000
- 折叠
摘要
Abstract
With the widespread use of the lfip-chip devices in production, the lfip-chip device in using also exposed some problems. For example, the lfip-chip device has delamination in underifll and voids or cracks in solder bumps, etc. All of those defects could cause the lfip-chip device failure. The paper collected the some SAM defects of lfip-chip devices and focused discussion on underifll and bumps. At the same time, this paper discussed discrimination and principle, etc.关键词
倒装器件/超声扫描显微镜/底充胶Key words
lfip-chip/scanning acoustic microscope/underifll分类
信息技术与安全科学引用本文复制引用
潘凌宇,张吉,杨城,马清桃,王伯淳..超声扫描显微镜检查在倒装器件检测中的应用[J].电子与封装,2014,(11):41-44,4.
