摘要
Abstract
With today’s microelectronics towards high-performance, subminiaturization, multifunction, the device power increases, the thermal dissipation characteristic of the package has become an important factor in the choice of suitable package technology. With excellent conductivity and electrical properties, metal package is a high precision packaging technology, it has good seal, free from the influence of external factors. The following article focuses on the parallel seam welding packaging technology of thick film hybrid integrated circuit, exploring the generally apperaring problems on the seam sealing packaging process, analysising and giving treatment options, thus ensuring the quality of the production of packaging products.关键词
平行缝焊/金属封装/设备参数Key words
parallel seam welding/metal package/parameter of apparatus分类
信息技术与安全科学
