摘要
Abstract
Parallel seam welding is a criticallid sealing technology in hermetic packaging of microelectronics monolithic integrated circuit and hybrid circuits. For this process, the quality levels of welded seam contribute a lot to the final sealing quality and reliability. In this process, welding locally happens in the edge area of the lid, resulting a very low bulk temperature of the package. However, if it is not in good control during processing, a high thermal stress will be introduced during welding and result in the the cracking at the location between seal ring and ceramic, which will lead to leak failure during screening and qualification tests. The paper will focus on the discussion of the assessment of seam quality.关键词
平行缝焊/气密封装/盖板Key words
parallel seam welding/hermetic packaging/lid分类
信息技术与安全科学
