电子与封装Issue(3)：5-8,34,5.
陶瓷封装中贴片胶溶剂扩散的研究
Research of Die Attach Adhesive Bleed out in Ceramic Packaging
葛秋玲 1陈陶1
作者信息
- 1. 无锡中微高科电子有限公司，江苏无锡 214035
- 折叠
摘要
Abstract
The use of die attach adhesive is an established practice in the micro-electronics industry. A problem which has plagued this die attach method is the phenomena of resin bleed out from the epoxy. When severe, this resin separation can interface with subsequent assembly process. Particularly susceptible to this effect are ceramic chip carriers. The objective of this investigation is to deifne the cause and effect relationship involved with epoxy bleed out. The article focuses on the behavior of die attach adhesive when applied to the metalized surfaces in ceramic chip carriers. The results of the experiments lead ultimately to a deifnition and solution of the bleed out problem.关键词
溶剂扩散/扩散机理/陶瓷封装Key words
resin bleed out/the mechanisms of bleed out/ceramic package分类
信息技术与安全科学引用本文复制引用
葛秋玲,陈陶..陶瓷封装中贴片胶溶剂扩散的研究[J].电子与封装,2015,(3):5-8,34,5.
