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CSOP型陶瓷小外形外壳工艺研究

余咏梅

电子与封装Issue(4):9-13,5.
电子与封装Issue(4):9-13,5.

CSOP型陶瓷小外形外壳工艺研究

The Technology Research of CSOP Type Ceramic Small Shape Shell

余咏梅1

作者信息

  • 1. 福建闽航电子有限公司,福建南平 353001
  • 折叠

摘要

Abstract

The paper introduces the key technology structure and product type CSOP ceramic small shape shell solutions, to improve the isolation resistance voltage; reduce the water vapor content, improving air tightness screening qualified rate; outer lead coplanarity; porcelain body appearance control; printing and perforation routing precision five topics are studied further, can better guide the CSOP type ceramic small shape shell mass production.

关键词

CSOP/隔离电压/水汽含量/气密性/共面性

Key words

CSOP/isolation voltage/moisture content/tightness/coplanarity

分类

信息技术与安全科学

引用本文复制引用

余咏梅..CSOP型陶瓷小外形外壳工艺研究[J].电子与封装,2015,(4):9-13,5.

电子与封装

1681-1070

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