电子元件与材料Issue(12)：17-20,4.DOI:10.14106/j.cnki.1001-2028.2014.12.005
Zn掺杂对Ni-Mn-Cu-O系NTC热敏电阻的影响
Effects of Zn-doping on Ni-Mn-Cu-O system NTC thermistor
摘要
Abstract
A batch of MF58 type thermistors with the composition of Ni0.5Mn2.38–xCu0.12ZnxO4(x=0, 0.2, 0.4, 0.6, 0.8) were prepared using the conventional solid state reaction method. The phase structures, microstructures and compositions of the prepared ceramics were investigated with the help of XRD, SEM and XPS characterization techniques;meanwhile, the effects of Zn content on the electrical properties and aging values of those thermistors were specially studied. The results show that with the increase of Zn content, the crystal structure of those solid solutions transforms from cubic spinel into tetragonal spinel;the resistivity and B constant of the thermistors increase gradually, and the aging value decreases sharply. After stored at 150℃ for 6 days , the aging value is as low as 0.33%for the Ni0.5Mn1.58Cu0.12Zn0.8O4 thermistor.关键词
NTC/热敏电阻/尖晶石/掺杂/电学性能/老化Key words
NTC/thermistor/spinel/doping/electrical properties/aging分类
化学化工引用本文复制引用
汪洋,王忠兵,李凤霞,汶建彤,陈春年..Zn掺杂对Ni-Mn-Cu-O系NTC热敏电阻的影响[J].电子元件与材料,2014,(12):17-20,4.基金项目
安徽省自然科学基金资助项目（No.1208085ME85）；国家科技型中小企业创新基金资助项目（No.07C26213210427）；国家火炬计划 （）
