电子元件与材料Issue(12)：89-93,5.DOI:10.14106/j.cnki.1001-2028.2014.12.023
塑封器件回流焊与分层的研究
Research on delamination of plastic packaging device in reflow soldering
刘培生 1卢颖 1杨龙龙 1刘亚鸿1
作者信息
- 1. 南通大学 江苏省专用集成电路设计重点实验室，江苏 南通 226019
- 折叠
摘要
Abstract
Due to the application of lead-free solders, the quality and reliability of plastic packaging devices are influenced by the increase of reflow temperature. A specified LQFP package was used as a demonstrator. The three dimensional model was established and the moisture diffusion in humid environment, deformation, thermal stress distribution of reflow soldering were analyzed by finite element software. The impacts of material parameters of molding compound and tiny crack on interface delamination were also discussed. The results show that the warping phenomenon is found at the apex angle of the device under the moisture and thermal load;delamination is easily produced in the interface between die and molding compound, and possibly leads to the device failure.关键词
塑封器件/湿气/回流焊/热应力/分层/可靠性Key words
plastic packaging device/moisture/reflow soldering/thermal stress/delamination/reliability分类
信息技术与安全科学引用本文复制引用
刘培生,卢颖,杨龙龙,刘亚鸿..塑封器件回流焊与分层的研究[J].电子元件与材料,2014,(12):89-93,5.
