电子元件与材料Issue(12)：94-97,4.DOI:10.14106/j.cnki.1001-2028.2014.12.024
废旧BGA器件二次利用的焊接强度研究
Soldering strength study of waste BGA package during reuse
摘要
Abstract
The BGA went through 2 000 h thermal aging to reach the waste package condition, then the waste BGA were broken up and repaired by falling weight and solder paste printing processes. Finally, the solder ball shear&pull tests were performed to measure the soldering strength by using Dage4000 tester. Results show that with the increasing aging time, the dominant failure mode turns from ductile to brittle. After solder joints repairing, the dominant failure mode is mixed modes. From the strength comparison, it is found that with the increasing aging time, the soldering strength decreases. After solder joints repairing, the soldering strength can recover to about 80% of original condition. The difference of soldering strength may be induced by the re-born inter metallic compound during the solder joints repairing.关键词
废旧BGA器件/焊接可靠性/老化/修复/金属间化合物/焊接强度Key words
waste BGA packages/solder joints reliability/aging/repair/inter metallic compound/soldering strength分类
矿业与冶金引用本文复制引用
张旻澍,谢安,卢智铨,李世玮..废旧BGA器件二次利用的焊接强度研究[J].电子元件与材料,2014,(12):94-97,4.基金项目
国家自然科学基金资助项目(No.11204258)；福建省自然科学基金资助项目(No.2012J05100)；福建省教育厅A类资助项目(No. JA13243) （No.11204258）
