电子元件与材料Issue(1)：26-28,3.DOI:10.14106/j.cnki.1001-2028.2015.01.006
封装用铜框架表面化学组成和粘接强度
Surface composition and adhesion strength of copper leadframes for electronic packaging
摘要
Abstract
Copper leadframes were treated at different temperatures and then used to prepare tensile test samples with the epoxy moulding compounds (EMC). XPS analysis indicates, the surfaces of raw copper leadframes are mainly composed of cuprous oxide and cupric hydroxide. Deep thermal treatment (175℃, 120 min) can lead to a more oxidized surface, that is mainly composed of cupric hydroxide and cupric oxide with cupric oxide mass fraction of 73%.关键词
铜框架/表面/氧化铜/氢氧化铜/XPS/粘接强度Key words
copper leadframes/surface/cupric oxide/cupric hydroxide/XPS/adhesion strength分类
信息技术与安全科学引用本文复制引用
卢晓林..封装用铜框架表面化学组成和粘接强度[J].电子元件与材料,2015,(1):26-28,3.基金项目
国家自然科学基金资助（No.51173169；No.21004054）；江苏省优势学科资助项目 （）
