电子元件与材料Issue(6)：74-77,4.DOI:10.14106/j.cnki.1001-2028.2015.06.019
焦耳热效应引发的晶须生长机理研究
Mechanism investigation of whisker growth induced by Joule heating effect
摘要
Abstract
Cu/Sn3.8Ag0.7Cu/Cu solder joint with current density of 5×103A/cm2 at 100℃ was investigated. Results show that after current stressing for 300 h, some hillocks occur at the anode interface and some cracks appear at the cathode interface. As the electromigration test goes on for 500 h, the cracks propagate along the cathode interface. Furthermore, a large quantity of Sn whiskers appears at the crack region, whose lengths are beyond 10μm. As the current stressing reaches 700 h, the total whisker quantity dosen’t increase, and stop growing. Due to the electromigration, the metal atoms migrate from the cathode side to the anode side by the electron wind force, resulting in the crack formation at the cathode interface. Therefore, the current density at the crack region increases, leading to much more Joule heat accumulation, to release the stress, some whiskers are formed in this crack region.关键词
焦耳热/电迁移/晶须/应力释放/无铅焊点/电流密度Key words
Joule heating/electromigration/whisker/stress release/lead-free solder joint/current density分类
信息技术与安全科学引用本文复制引用
何洪文,曹立强,聂京凯,朱承治..焦耳热效应引发的晶须生长机理研究[J].电子元件与材料,2015,(6):74-77,4.基金项目
国家电网公司“电网用智能材料若干基础研究”科技项目资助；国家自然科学基金资助 （）
