电子元件与材料Issue(7)：82-87,6.DOI:10.14106/j.cnki.1001-2028.2015.07.021
柔性凸点热-结构耦合应力应变有限元分析
FEA study on the stress and strain of solder joint with compliant layer based on thermal-structure coupling
摘要
Abstract
The 3D finite element analysis model of chip scale package solder joints with compliant layer was established, the thermal-structure coupling finite element analysis of the model was performed, the temperature field and stress and strain distribution of the solder joints with complaint layer were obtained under the condition of thermal-structure coupling, the stress and strain magnitude between the solder joints with complaint layer and the solder joints without complaint layer were compared, the influences of the thickness of compliant layers, the diameter thicknesses of up pad and down pad on the stress and strain of solder joints with compliant layer structure were studied. Results show that the compliant layer structure can reduce the stress and strain of solder joints effectively. With the increase thickness of compliant layer, the maximum stress and strain of the solder joints decrease. With the increase diameter of the up and down pad, the maximum stress and strain within the solder joints with complaint layer have no obvious regularity.关键词
焊点/热-结构耦合/柔性层/焊盘直径/有限元分析/温度场Key words
solder joint/thermal-structure coupling/compliant layer/pad diameter/finite element analysis/temperature field分类
矿业与冶金引用本文复制引用
周兴金,黄春跃,梁颖,李天明,邵良滨..柔性凸点热-结构耦合应力应变有限元分析[J].电子元件与材料,2015,(7):82-87,6.基金项目
国家自然科学基金资助项目（No.51465012）；广西壮族自治区自然科学基金资助项目（No.2012GXNSFAA053234；No.2013GXNSFAA019322）；四川省教育厅科研资助项目 （）
