电子与封装Issue(8)：1-8,8.
硅通孔（TSV）转接板微组装技术研究进展
Development of Micropackage Technology for Through Silicon Via (TSV) Interposer
摘要
Abstract
In recent years, 3D integration technology with the key technology of through silicon via (TSV) has been a research and development hotspot of semiconductor industry. Especially, 2.5D TSV interposer technology has been provided a solution for substituting low cost small size die system package for high cost system on chip (SOC). As the medilayer, interposer achieves 3D interconnection between die to die and die to substrate, and has reduced the cost of system on chip and power consumption. In the structure of 3D package based on TSV interposer, there have been very huge challenges for micropackage technology and reliability of interposer, with new type package structures and materials introduced, and with large size high power die and small size fine pitch microbumps applied. In the paper, the currently research of TSV interposer micropackage was summarized, including the key questions and development of warpage of interposer, pinpoint between die and interposer, materials of micropackage, and technics choice, etc.关键词
硅通孔(TSV)/转接板/微组装技术/基板/2.5D/3D集成Key words
through Silicon via (TSV)/interposer/micropackage/substrate/2.5D/3D integration分类
信息技术与安全科学引用本文复制引用
刘晓阳,刘海燕,于大全,吴小龙,陈文录..硅通孔（TSV）转接板微组装技术研究进展[J].电子与封装,2015,(8):1-8,8.基金项目
国家科技重大专项（2011ZX02709-2）；国家自然科学基金 （）
